100% material declaration data sheet SO8 pk227 (v1.0) august 15, 2007 mate rial declaration data sheet average weight: 0.081174 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.00396 4.88% silicon 7440-21-3 100.00 0.00396 die attach material 0.00124 1.53% epoxy resin(ep) 19690-82-2 21.00 0.0002604 silver 7440-22-4 70.00 0.000868 misc. 9.0 (metal oxide, amine, gamma butyrolactone) 0.0001116 mold compound 0.041768 51.45% resin trade secret 7.50 0.003132 sio2 filler 60676-86-0 86.00 0.035921 carbon black 1333-86-4 0.50 0.000209 epoxy cresol novolac trade secret 2.00 0.000835 phenol resin trade secret 4.00 0.001671 leadframe 0.031948 39.36% copper 7440-50-8 97.50 0.031184 iron 7439-89-6 2.35 0.000752 phosphorus 7723-14-0 0.03 0.000009 zinc 7440-66-6 0.12 0.000003 leadframe plating 0.000559 0.69% silver 7440-22-4 100.00 0.000559 bond wire 0.000223 0.27% gold 7440-57-5 100.00 0.000223 ext. plating 0.001476 1.82% tin 7440-31-5 85.00 0.001254 lead 7439-92-1 15.00 0.000221 pk227 (v1.0) august 15, 2007 www.xilinx.com 1 ? 2007 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? SO8 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 8/15/07 1.0 initial release. pk227 (v1.0) august 15, 2007
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